Cisco Systems, Inc.
Apparatus and method for dissipating heat with microelectromechanical system

Last updated:

Abstract:

In one or more embodiments, an apparatus generally comprises a microelectromechanical system (MEMS) module comprising a plurality of air movement cells and a power unit operable to control the plurality of air movement cells, and a housing configured for slidably receiving the MEMS module and positioning the MEMS module adjacent to a heat generating component of a network device. The MEMS module is operable to dissipate heat from the heat generating component and is configured for online installation and removal during operation of the heat generating component.

Status:
Grant
Type:

Utility

Filling date:

6 Oct 2020

Issue date:

14 Jun 2022