Cisco Systems, Inc.
Stiffener device providing external connections to co-packaged optical devices

Last updated:

Abstract:

Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.

Status:
Grant
Type:

Utility

Filling date:

23 Dec 2020

Issue date:

19 Jul 2022