Lionheart Holdings
THREE-DIMENSIONAL MICROSTRUCTURES

Last updated:

Abstract:

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

Status:
Application
Type:

Utility

Filling date:

23 May 2019

Issue date:

5 Mar 2020