Diodes Incorporated
Thinned semiconductor chip with edge support

Last updated:

Abstract:

A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.

Status:
Grant
Type:

Utility

Filling date:

12 Mar 2020

Issue date:

15 Feb 2022