Entegris, Inc.
Post-etch residue removal for advanced node beol processing

Last updated:

Abstract:

The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.

Status:
Grant
Type:

Utility

Filling date:

17 Jan 2018

Issue date:

29 Sep 2020