Entegris, Inc.
Post-etch residue removal for advanced node beol processing
Last updated:
Abstract:
The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.
Status:
Grant
Type:
Utility
Filling date:
17 Jan 2018
Issue date:
29 Sep 2020