Entegris, Inc.
Wafer contact surface protrusion profile with improved particle performance

Abstract:

An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.