Entegris, Inc.
CERIA REMOVAL COMPOSITIONS

Last updated:

Abstract:

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

Status:
Application
Type:

Utility

Filling date:

5 Feb 2020

Issue date:

13 Aug 2020