Telefonaktiebolaget LM Ericsson (publ)
Cooling package and power module

Abstract:

A cooling package in a power module comprises a first side for placing one or more semiconductor components; one or more holes for placing one or more magnetic components; and a second side with one or more connection parts. Therefore, all components of a power module which need to dissipate the heat have two thermal dissipation paths, therefore the heat inside the module can be greatly reduced.