Flex Ltd.
ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING

Abstract:

Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.