Flex Ltd.
FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD

Abstract:

Embodiments of the present disclosure are directed to using direct ink printing on chips or interposer pads to replace the other die bonding process, e.g., conductive adhesive, Anisotropic Conductive Film (ACF), solder, etc. Direct printing on contact pads of chips and/or interposers to replace using ACF bonding provides simplicity of manufacturing process, reduced cost by eliminating ACF, reduced interconnect resistance by eliminating ACF interface, and increased reliability by eliminating ACF bonding instability. Direct printing according to embodiments of the present disclosure can make complex design patterns with fine pitch capability (sub 10 micron is feasible by using aerosol jet printing, 30 microns or above for screen printing). Such direct printing can also enable roll to roll printing process for high volume production.