Flex Ltd.
System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features

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Abstract:

An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.

Status:
Grant
Type:

Utility

Filling date:

15 May 2018

Issue date:

15 Jun 2021