Ferro Corporation
Low K dielectric compositions for high frequency applications

Abstract:

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950.degree. C. or below 1100.degree. C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO.sub.2, 5-35 mole % or 0.1-35 mole % B.sub.2O.sub.3, 0.1-10 mole % or 0.1-25 mole % Al.sub.2O.sub.3, 0.1-10 mole % K.sub.2O, 0.1-10 mole % Na.sub.2O, 0.1-20 mole % Li.sub.2O, 0.1-30 mole % F. The total amount of Li.sub.2O+Na.sub.2O+K.sub.2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.