General Electric Company
ENHANCED PHOTONIC ASSEMBLY

Abstract:

This disclosure generally relates to systems and methods for improving adhesive bonding between a layer of a device that transmits optical signals, such as a photonics integrated circuit, and a waveguide that helps to transmit at least some of the optical signals. Adhesion methods may include using vapor-phase encapsulation, capillary underfill, or compressive displacement to secure the waveguide to at least one layer of the device that transmits optical signals. In each of these methods, the adhesion method may create an adhesive interface between at least a portion of the waveguide and a contacting layer of the device that transmits optical signals.