General Electric Company
SYSTEMS AND METHODS FOR THERMAL MONITORING

Abstract:

A thermal monitoring system (101) for sensing a temperature of a monitored device (104) includes a carrier (102) having a first surface (112) and a biasing element (122) coupled to the carrier (102) and configured to extend between the carrier (102) and the monitored device (104) to provide a first thermal conduction path therebetween. The biasing element (122) includes a first end (128) contacting the first surface (112) and a second end (130) opposite the first end (128) and configured to contact the monitored device (104). The biasing element (122) further includes a main body (132) formed of a thermally conductive material extending continuously between the first end (128) and the second end (130). The main body (132) is compressible between the monitored device (104) and the carrier (102). The thermal monitoring system (101) further includes a temperature sensor (124) coupled to the carrier (102) and configured to detect a temperature of the monitored device (104).