General Electric Company
COOLING DEVICE FOR AN ELECTRONICS MODULE

Abstract:

A device for cooling an electronic component includes a substrate having a component mounting surface and a fluid flow surface recessed relative to the component mounting surface. The device also includes an inlet orifice positioned proximate a first end of the fluid flow surface and an outlet orifice positioned proximate a second end of the fluid flow surface. A pattern of surface features is arranged on the fluid flow surface. The pattern of surface features is configured to entrain a coolant flowing across the fluid flow surface and redirect the coolant upward and away from the fluid flow surface.