General Electric Company
NEURAL MULTIELECTRODE ARRAYS AND THEIR MANUFACTURE AND USE

Abstract:

The present approach relates to the fabrication of probes of a probe array device using wire bonding techniques. In certain implementation, a wire bond apparatus bonds ones end of a wire to a region of a probe array substrate. The second end, however, is not bonded to the substrate and instead is either fabricated to be vertical with respect to the substrate or raised from a non-bonded site to be vertical. The process may be repeated to form multiple probes of the probe array.