General Electric Company
Methods and systems for manufacturing an ultrasound probe

Abstract:

Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.