General Electric Company
Super-junction semiconductor device fabrication

Last updated:

Abstract:

To manufacture a super-junction (SJ) layer of a SJ device, an epitaxial (epi) layer having a first conductivity type may be formed on an underlying layer, which may be formed from a wide-bandgap material. A first mask may then be formed onto a first portion of the epi layer, and a first set of SJ pillars may be selectively implanted into a second portion of the epi layer exposed by the first mask. Then, a second mask may be formed on the second portion of the epi layer that is self-aligned relative to the first mask. After removing the first mask, a second set of SJ pillars may be selectively implanted into the first portion of the epi layer. Removing the second mask may then yield the SJ layer.

Status:
Grant
Type:

Utility

Filling date:

20 Dec 2018

Issue date:

28 Apr 2020