General Electric Company
Planar balun and multi-layer circuit board

Abstract:

The present invention provides a planar balun and a multi-layer circuit board. The planar balun formed on the multi-layer circuit board comprises: a first winding with at least one turn, which is formed in a first conductive layer, and has a first lead and a second lead serving as a first balanced end and a second balanced end of the balun respectively; a second winding with at least one turn, which is formed in a second conductive layer separated from the first conductive layer by at least a first insulating layer, and has a third lead and a fourth lead, wherein the third lead is connected to a ground potential, and the fourth lead serves as an unbalanced end of the balun; and a first balancing capacitor, which is connected between a selected portion near a center of the first winding and the ground potential.