General Electric Company
Adhesion of a substrate onto a CMC component

Abstract:

Methods for adhering a substrate onto a surface of a ceramic component are provided. The method may include applying a first bond coating onto an attachment surface of the substrate, applying a first alumina coating onto the first bond coating on the attachment surface of the substrate, applying a second bond coating onto an outer surface of the ceramic component, applying a second alumina coating onto the second bond coating on the attachment surface of the substrate, applying a cement onto at least one of the first alumina coating and the second alumina coating, and adhering the attachment surface of the substrate onto the outer surface of the ceramic component. Connections between a metal substrate and a ceramic matrix composite component are also provided.