General Electric Company
LASER ABLATION SEAL SLOT MACHINING

Abstract:

Systems and methods of laser ablating a component to form a cavity are provided. In one aspect, a laser system laser ablates a component to remove a slice of material therefrom so that at least a portion of a section of the cavity is formed. With the slice of material removed, the laser system laser ablates the component along an outline of the section to remove excess sidewall material therefrom to form one or more sidewalls of the section. This removes tapering of the sidewalls. This process can be iterated to form the depth of the cavity. The laser system then laser ablates the component to remove excess end wall material therefrom to form an end wall of the cavity to a predetermined depth.