Corning Incorporated
Bendable electronic device modules, articles and bonding methods of making the same

Abstract:

A foldable electronic device module that includes a glass cover element having a thickness from about 25 .mu.m to about 200 .mu.m, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 .mu.m to about 600 .mu.m; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.