Corning Incorporated
ENHANCED STRENGTH OF GLASS BY COMBINING REDRAW AND CHEMICAL THINNING PROCESSES

Abstract:

A cover element for an electronic device that includes a glass element having a thickness from 20 .mu.m to 125 .mu.m, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.