Corning Incorporated
METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING MODIFIED PULSE BURST PROFILES

Abstract:

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration T.sub.bd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength .lamda., a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than F D .times. .pi. .times. w o 2 .lamda. , ##EQU00001## where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.