Corning Incorporated
LOW TEMPERATURE METHODS FOR DEPOSITING INORGANIC PARTICLES ON A METAL SUBSTRATE AND ARTICLES PRODUCED BY THE SAME

Abstract:

Methods for depositing inorganic particles including titanium carbonitride on a metal substrate via chemical vapor deposition (CVD). In some embodiments, the CVD process may be supplied by two or more source gasses that react to form the inorganic particles. At least one of the sources gases includes a titanium source gas. And a source of carbon and nitrogen may be (a) a single source gas including a carbon and nitrogen source gas with a heat of formation energy that is less than 65.9 kilojoules per mole and/or (b) two source gases including a carbon source gas with a gas molecule having a carbon-nitrogen single bond and a nitrogen source gas. In some embodiments, the CVD process may be supplied by a source gas including a metalorganic compound to form the inorganic particles. In some embodiments, the CVD process may be supplied by an aluminum-containing metalorganic reducing agent.