Corning Incorporated
LEAD FREE GLASS COMPOSITION FOR MICROCHANNEL PLATE FABRICATION

Abstract:

Disclosed herein are lead free glass compositions having, in some embodiments, SiO.sub.2 from 25 wt % to 60 wt %, Al.sub.2O.sub.3 from 0 wt % to 20 wt %, B.sub.2O.sub.3 from 0 wt % to 35 wt %, ZrO.sub.2 from 0 wt % to 5 wt %, Li.sub.2O from 5 wt % to 17 wt %, Na.sub.2O from 3 wt % to 10 wt %, K.sub.2O from 1 wt % to 10 wt %, R.sub.2O from 0 wt % to 20 wt %, wherein R.sub.2O is an alkaline earth oxide, ZnO from 0 wt % to 15 wt %, and 0 wt % lead.