Corning Incorporated
GLASS CARRIER FOR DIE-UP FAN-OUT PACKAGING AND METHODS FOR MAKING THE SAME

Abstract:

A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer (105) fused to a glass core layer (110), the glass substrate comprising a cavity (425), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component (700) disposed in the cavity, and an encapsulant (702) sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.