Corning Incorporated
SUBSTRATE TRANSPORTING APPARATUS

Last updated:

Abstract:

A substrate transporting apparatus including a carrier that is configured to support a substrate to be processed. A plurality of holes are disposed within the carrier, each hole extending from a first surface to a second surface of the carrier, the plurality of holes including at least a first hole and a second hole. A first bearing device is disposed in the first hole, the first bearing device including a first shaft, a first head, and an internal opening extending an entire length of the first shaft and the first head. The second hole is either (i) is an open hole without a bearing device disposed therein, or (ii) has a second bearing device disposed therein, the second bearing device including a second shaft and a second head without an internal opening disposed through the second shaft.

Status:
Application
Type:

Utility

Filling date:

25 Feb 2022

Issue date:

8 Sep 2022