Corning Incorporated
LAMINATED GLASS STRUCTURES WITH ENHANCED THERMAL AND MOISTURE-RESISTANCE

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Abstract:

A laminated glass structure is provided that includes: a substrate, a flexible glass sheet, a buffer layer, a first adhesive and a second adhesive. The substrate has a thickness from about 2.5 mm to about 50 mm and primary surfaces. The buffer layer has a thickness from about 0.1 mm to about 2.5 mm and is laminated to the substrate with the first adhesive. The flexible glass sheet has a thickness of no greater than 0.3 mm and is laminated to the buffer layer with the second adhesive. Further, the buffer layer is characterized by an elastic modulus of at least 70 GPa and a coefficient of thermal expansion between about 4 and 25 ppm*.degree. C..sup.-1.

Status:
Application
Type:

Utility

Filling date:

1 Jun 2017

Issue date:

22 Jul 2021