Corning Incorporated
ACCELERATED THERMAL CROSSLINKING OF PVDF-HFP VIA ADDITION OF ORGANIC BASES, AND THE USAGE OF CROSSLINKED PVDF-HFP AS GATE DIELECTRIC MATERIAL FOR OTFT DEVICES

Abstract:

The present disclosure describes a method of crosslinking fluoroelastomers, or more precisely thermally-crosslinkable fluorine-containing polymers, and to devices such as OTFTs (organic thin film transistors) incorporating such polymers. In some embodiments, a method comprises mixing: a solvent, a thermally crosslinkable fluorine-containing polymer, and one or more organic bases to form a mixed solution. The mixed solution is deposited over a substrate to form a first layer. The first layer is then crosslinked by thermal treatment to form a crosslinked first layer. The polymer is selected from: homopolymers of vinylidene fluoride; and copolymers of vinylidene fluoride with fluorine-containing ethylenic monomers. The one or more organic bases each have a pKa of 10 to 14.