Corning Incorporated
THROUGH-SUBSTRATE LASER PATTERNING AND ISOLATING OF THIN CONDUCTIVE FILMS

Abstract:

An invention disclosure discloses a composite structure. The composite structure includes a substrate layer (120), a conductive layer (140) and an overlayer (160). The substrate has a first face (124) and a second face (122). The conductive layer has a first face (148) and a second face (149). The first face of the conductive layer is disposed on the at least a part of the second face of the substrate layer. A portion (144) of the conductive layer has a resistivity at least about ten times higher than an adjacent region (146) on the conductive layer. The overlayer may have a first face (162) and a second face (166). The first face of the overlayer is disposed on at least a part of the second face of the conductive layer such that the conductive layer is disposed between the overlayer and the substrate layer. The substrate layer comprises a material that is optically transparent over at least a part of the electromagnetic spectrum from about 180 nm to about 20 .mu.m. The conductive layer comprises a layer having a thickness of about 10 nm or greater and having a resistivity of about 10 Ohm-cm or less. The conductive layer comprises a material that may be optically translucent or opaque over at least a part of the electromagnetic spectrum from about 180 nm to about 20 .mu.m.