Corning Incorporated
ORGANIC/INORGANIC LAMINATES FOR HIGH FREQUENCY PRINTED CIRCUIT BOARD APPLICATIONS

Abstract:

A PCB laminate material includes at least one polymer layer and at least one inorganic layer, such that the PCB laminate material has a dielectric loss tangent of less than 6.times.10.sup.-3 at 10 GHz (or higher frequency). The inorganic layer or layers of the PCB laminate material may comprise silica-based materials (including silica fabrics), low-loss glass with a dielectric loss tangent of about 0.006 at 10 GHz (or higher frequency), glass-ceramics, or ceramic materials (e.g., alumina). PCB laminate materials may also include at least one fluoropolymer layer. PCB laminate materials described herein combine good dielectric performance (i.e., low dielectric loss), dimensional stability at elevated temperature (e.g., at 260.degree. C. for 30 seconds), and sufficient mechanical strength to permit handling during production. Printed circuit boards comprising the PCB laminate materials and methods for making the same are also disclosed herein.