Corning Incorporated
HIGH SILICATE GLASS ARTICLES POSSESSING THROUGH GLASS VIAS AND METHODS OF MAKING AND USING THEREOF

Abstract:

Disclosed herein are glass compositions with high silica content that present several advantages over glasses and other materials currently used for redistribution layers for RF, interposers, and similar applications. The glasses disclosed herein are low cost, flat glasses that have high throughput for the laser damage and etching process used to create through glass vias (TGVs). TGVs generated using the silicate glasses and processes described herein have large waist diameters, which is a desirable feature with respect to producing glass articles such as interposers.