Corning Incorporated
HIGHLY LOADED INORGANIC FILLED AQUEOUS RESIN SYSTEMS

Abstract:

This disclosure provides A resin system comprising (1) a resin including (i) 1-30 wt % of a binder comprising an aqueous-soluble, photopolymerizable monomer, oligomer, or polymer, (ii) 1-20 wt % of an emulsion component; and (ii) from greater than 0 to 10 wt % of a photoinitiator, and (2) 41-90 wt % of a filler including glass or glass ceramic particles wherein the particles have an average size along their longest dimension of from 5 nm to 20 .mu.m.