Corning Incorporated
APPARATUSES AND METHODS FOR NON-CONTACT HOLDING AND MEASUREMENT OF THIN SUBSTRATES

Abstract:

An apparatus for holding a thin substrate includes a plurality of positive pressure regions including a porous material having an upper surface and a gas flowing outward from the upper surface, the gas producing a positive pressure above the upper surface in the positive pressure regions. The apparatus includes a plurality of negative pressure regions interspersed with the plurality of positive pressure regions, the negative pressure regions exerting a holding force on a bottom surface of the thin substrate. The negative pressure regions and the positive pressure regions operate to maintain the bottom surface of the thin substrate a distance from the upper surface of the porous material in the positive pressure regions. Methods of holding a thin substrate with the apparatus are also disclosed.