Corning Incorporated
SURFACE MODIFICATION BY LOCALIZED LASER EXPOSURE

Abstract:

The system may include a rotatable stage configured to support a ceramic substrate and an energy emitter positioned adjacent to the ceramic substrate. In some cases, the energy emitter may be configured to transmit an energy beam toward one or more outer faces of the ceramic substrate so as to modify a surface roughness of the one or more outer faces. In some cases, the method may include identifying a target surface roughness based at least in part on a target friction coefficient, and identifying a target surface area of the ceramic substrate, transmitting an energy beam toward the surface of the ceramic substrate via an energy emitter positioned adjacent to the ceramic substrate, and heating the target surface area of the surface of the ceramic substrate until a surface roughness of the target surface area is within a predetermined range of the target surface roughness.