Corning Incorporated
Foldable electronic device assemblies and cover elements for the same

Abstract:

A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress .sigma..sub.I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress .sigma..sub.B at the first primary surface in tension, .sigma..sub.I+.sigma..sub.B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.