Corning Incorporated
Laser welded glass packages

Abstract:

An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which .sigma..sub.HAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein .sigma..sub.HAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its .sigma..sub.interface laser weld>.sigma..sub.HAZ, wherein .sigma..sub.interface laser weld is peak value of compressive stress in the laser welded zone.