Corning Incorporated
Carriers for microelectronics fabrication

Abstract:

Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm.sup.2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 .mu.m to about 150 .mu.m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m.sup.2 providing for a flat fragmentation factor of less than or equal to 5.