Corning Incorporated
Mechanically flexible and durable substrates and method of making

Abstract:

A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 .mu.m and has at least one of: a) a brittleness ratio less than about 9.5 (.mu.m).sup.-1/2, or b) a fracture toughness of at least about 0.75 MPa(m).sup.1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 .mu.m and having at least one of: a) a brittleness ratio of less than about 9.5 (.mu.m).sup.-1/2, or b) a fracture toughness of at least about 0.75 MPa(m).sup.1/2; and then forming a substrate from the selected inorganic material.