Corning Incorporated
Laser cutting of materials with intensity mapping optical system

Abstract:

A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.