Corning Incorporated
Sealed device housing with particle film-initiated low thickness laser weld and related methods

Abstract:

A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 .mu.m, and the inorganic particle layer has an average thickness of less than or equal to 5 .mu.m.