Honda Motor Co., Ltd.
In-mold electronics within vehicle exterior

Abstract:

A vehicle having in-mold electronics is provided. According to one or more aspects, a vehicle includes a vehicle computing device, for controlling the vehicle, and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the vehicle computing device. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part that forms an exterior portion of the vehicle.