Honda Motor Co., Ltd.
SEMICONDUCTOR APPARATUS

Abstract:

A semiconductor apparatus includes a chip laminate body in which a plurality of memory chips are laminated on a logic chip that controls each of the plurality of memory chips, wherein the chip laminate body includes a plurality of penetration electrodes that penetrate through the plurality of memory chips and the logic chip in a thickness direction and includes a bumpless structure in which the plurality of memory chips and the logic chip are electrically connected together via the plurality of penetration electrodes without arranging a bump electrode in each space among the plurality of memory chips and the logic chip, and a conductance of a first transistor provided on the plurality of memory chips is smaller than a conductance of a second transistor provided on the logic chip.