Honda Motor Co., Ltd.
LASER PROCESSING APPARATUS

Abstract:

A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.