Honda Motor Co., Ltd.
Laser processing method and laser processing device

Abstract:

Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.