Honeywell International Inc.
Method of forming copper alloy sputtering targets with refined shape and microstructure

Abstract:

A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650.degree. C. to about 750.degree. C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500.degree. C. to about 650.degree. C. to form a copper alloy.