Honeywell International Inc.
Crack-resistant polysiloxane dielectric planarizing compositions, methods and films

Abstract:

A composition for planarizing a semiconductor device surface includes a catalyst, at least one solvent, and at least one polysiloxane resin including polysilsesquioxane blocks and polydisiloxane blocks. The polydisiloxane blocks are according to the general formula: ##STR00001## wherein R.sub.1, R.sub.2 are each independently selected from the group consisting of: an aryl group or an alkyl group, with substituted or unsubstituted carbons.