Honeywell International Inc.
Crack-resistant silicon-based planarizing compositions, methods and films

Abstract:

A composition for planarizing a semiconductor device surface includes a silicon-based material and a cross-linker including a siloxane compound according to the general formula: ##STR00001## wherein R is an aliphatic comprising group and R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, and R.sub.6 are each independently selected from the group consisting of: H or an alkyl group with substituted or unsubstituted carbons.