Honeywell International Inc.
WATER SOLUBLE POLYMERS FOR PATTERN COLLAPSE MITIGATION

Abstract:

A method for preventing the collapse of patterned, high aspect ratio features formed in semiconductor substrates upon removal of an initial fluid of the type used to clean etch residues from the spaces between the features. In the present method, the spaces are at least partially filled with a displacement solution, such as via spin coating, to substantially displace the initial fluid. The displacement solution includes at least one solvent and at least one fill material in the form of a water-soluble polymer such as polyvinylpyrrolidone (PVP) or polyacrylamide (PAAM). The solvent is then volatized to deposit the fill material in substantially solid form within the spaces. The fill material may be removed by known plasma ash process via a high ash rate as compared to use of current fill materials, which prevents or mitigates silicon loss.